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We are TMS YOUR Total Manufacturing Solution
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DIGITAL BOARDS RF CIRCUIT BOARDS FLEX & RIGID FLEX BOARDS Your challenge as a Buyer or Design Engineer, is to find high quality, competitively priced printed circuit boards and interconnect solutions for your end product.  At TMS, our customers expect Excellent Quality, On-Time Delivery and the BEST PRICING.  That is precisely what TMS DELIVERS. Top Quality, Cost Effective SOLUTIONS.

DIGITAL BOARDS

TIME TO MARKET Prototype / NPI:  2 to 5 Days Production:  2 to 4 Weeks Up to 40 Layers Trace/Space  2/2 Heavy Copper up to 10 oz. Blind/Buried Vias Controlled Impedance HDI Aspect Ratio 16:1 All Surface Finishes
TIME TO MARKET Prototype / NPI:  3 to 5 Days Production:  2 to 4 Weeks Hybrid Multilayers Teflon Packages Castellations Edge Plating Blind Vias Metal Back Bonded Assemblies Pre Bond / Post Bond

RF CIRCUIT BOARDS

FLEX & RIGID FLEX BOARDS

TIME TO MARKET Prototype / NPI:  3 to 5 Days Production:  2 to 6 Weeks Multilayer Flex to 12 Layers Rigid Flex to 30 Layers IPC 6013 Types 1, 2, 3, & 4 Dynamic & Static Applications Silver Film & Silver Ink EMI Adhesive Based & Adhesiveless Materials Balanced & Unbalanced Construction
We are TMS YOUR  Total Manufacturing Solution
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