TMS Advanced Technology

From standard technology to complex, high density circuits incorporating the latest technology, TMS is your SOLUTION. TMS has the technical resources to be a competent advisor and supplier for all of your PCB needs

TECHNOLOGY

• Board Thickness - Min. 0.005 Max. 0.260 • Panel/Board Dim. - Min Panel Dim=9"x12" Max Panel Dim=24"x28" Max Circuit Dim=21"x28" • Min Lines & Spaces - Inner Layer Lines=0.002" Outer Layer Lines=0.003" Inner Layer Spaces=0.002" Outer Layer Spaces=0.003" • Layer Count - Max Layers-Rigid Boards=40 Max Layers-Multilayer Flex=12 Max Layers-Rigid Flex=30 • Copper Weight - Inner Layers=0.25 oz. - 10 oz. Outer Layers=0.25 oz. - 8 oz. • Drilling - Min Drilled Hole=0.006" Hole Location Accuracy=0.0012" Image to Hole Accuracy=0.004" Aspect Ration=1:16 • Laser Drilling - Microvia Drill Diameter=0.003" Microvia Aspect Ration=1.1 Microvia Via Pad=0.006" Microvia Dielectric Thickness=0.004" • Solder Mask - Min Clearance SMD Pads=0.0010" Min Dams Between SMD Pads=0.004" Solder Mask Colors=ALL • Machining - Routing Tolerance=0.004" Hole to Edge Location=0.002 Laser V-Groove Angle Capability=20, 30, 45

Surface Finish HASL Lead Free HASL Enig Immersion Silver Immersion Tin OSP Hard Gold Soft Gold EnigP

Specifications UL ISO Mil 31032 IPC Class II & III

TMS has provided the following links to these industry suppliers and organizations. Taconic www.taconic-add.com Rogers www.rogerscorp.com Arlon www.arlon.com DuPont Pyralux www.dupont.com/pyralux Nelco www.parkelectro.com IPC www.ipc.org Isola www.isola-group.com Ventec www.ventec-usa.com